The **ATS-08A-55-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink from the *maxiFLOW™* series. --- ### 1. Technical Specifications This part is designed for high-density electronic cooling where airflow is directed. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 4.84°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Fine Pitch (Tapered) | --- ### 2. Design Characteristics The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties: * **Heat Sink Profile:** It features a **tapered fin design** which increases surface area and improves heat dissipation in environments with low-to-medium pressure drops. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **ATS-CP-506**, a high-performance thermal pad that ensures optimal heat transfer between the electronic component (CPU, FPGA, ASIC) and the aluminum base. * **Attachment:** The `pushPIN™` system uses a brass component and a compression spring to provide precise pressure, ensuring the heat sink stays flush against the chip even during mechanical shock or vibration. --- ### 3. Application Use Cases This specific part is used in electronics where heat must be dissipated from integrated circuits to prevent thermal throttling or hardware failure. * **Telecommunications:** Used on high-speed networking chips and routers. * **Embedded Systems:** Ideal for small form factor industrial computers. * **Power Electronics:** Cooling for MOSFETs or high-density power modules. --- ### 4. Part Number Breakdown The suffixing provides information on the specific configuration: | Suffix | Meaning | | :--- | :--- | | **-C2** | Denotes the finish (Black Anodized) and thermal performance grade. | | **-R0** | Indicates the revision or specific packaging/kit configuration. |