The **ATS-08A-84-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and characteristics. ### 1. General Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push pin" heat sink series. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-08A-84-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits on the PCB without interfering with neighboring components. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 30.00mm x 30.00mm | | **Height (Off Base)** | 25.00mm | | **Fin Style** | Straight | | **Weight** | ~12.5 grams | --- ### 3. Thermal Performance Thermal resistance determines how effectively the heat sink transfers heat from the component to the ambient air. It is measured in degrees Celsius per Watt (°C/W). | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 7.00 | | **300 LFM (1.5 m/s)** | 5.33 | | **400 LFM (2.0 m/s)** | 4.48 | | **500 LFM (2.5 m/s)** | 3.93 | --- ### 4. Key Components & Features * **Push-Pin Mounting:** This model uses a plastic push-pin with a spring-loaded mechanism. This ensures consistent pressure (clamping force) on the high-heat component for better thermal transfer. * **Straight Fin Design:** The fins are arranged in a straight-line pattern, making it ideal for systems with directed airflow (unidirectional). * **Blue Anodized Coating:** The blue finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** This specific "R0" variant typically comes with **T766** thermal tape or grease pre-applied to the base to simplify installation. --- ### 5. Application Usage This part is commonly found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for a 25mm height.