ATS-08A-90-C2-R0
AI

The **ATS-08A-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and ASICs.
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### ## Technical Specifications
Below are the primary electronic and physical parameters for the ATS-08A-90-C2-R0:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 6.36°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### ## Key Electronic Features
### 1. maxiFLOW™ Fin Geometry
The "90" in the part number refers to the specific fin density and orientation. The maxiFLOW design features a tapered fin structure that increases the surface area while reducing the pressure drop. This is critical in high-density electronic enclosures where airflow is limited.
### 2. pushPIN™ Attachment System
This component uses a mechanical attachment system rather than adhesive. This is preferred in high-reliability electronics for several reasons:
* **Constant Pressure:** Ensures consistent contact between the heat sink and the electronic chip.
* **Easy Rework:** Allows for removal and re-installation during PCB testing.
* **Shock Resistance:** The spring-loaded pins protect the silicon die from mechanical stress during shipping or vibration.
### 3. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. In electronics, the TIM is vital because it fills microscopic air gaps between the heat sink and the component (like a processor), significantly lowering the thermal contact resistance.
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### ## Thermal Performance Matrix
Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic chassis:
| Airflow Velocity | Thermal Resistance (Unducted) |
| :--- | :--- |
| **100 LFM (0.5 m/s)** | 8.82 °C/W |
| **200 LFM (1.0 m/s)** | 6.36 °C/W |
| **300 LFM (1.5 m/s)** | 5.17 °C/W |
| **400 LFM (2.0 m/s)** | 4.49 °C/W |
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### ## Component Identification
The part number can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **08A:** Series/Size designation
* **90:** Fin height/density configuration
* **C2:** Material/Finish (Blue Anodized Aluminum)
* **R0:** Revision/Packaging code
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What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink available with a clip-on attachment instead of pins?