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  • ATS-08A-90-C2-R0

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    The **ATS-08A-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and ASICs. --- ### ## Technical Specifications Below are the primary electronic and physical parameters for the ATS-08A-90-C2-R0: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.36°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### ## Key Electronic Features ### 1. maxiFLOW™ Fin Geometry The "90" in the part number refers to the specific fin density and orientation. The maxiFLOW design features a tapered fin structure that increases the surface area while reducing the pressure drop. This is critical in high-density electronic enclosures where airflow is limited. ### 2. pushPIN™ Attachment System This component uses a mechanical attachment system rather than adhesive. This is preferred in high-reliability electronics for several reasons: * **Constant Pressure:** Ensures consistent contact between the heat sink and the electronic chip. * **Easy Rework:** Allows for removal and re-installation during PCB testing. * **Shock Resistance:** The spring-loaded pins protect the silicon die from mechanical stress during shipping or vibration. ### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is vital because it fills microscopic air gaps between the heat sink and the component (like a processor), significantly lowering the thermal contact resistance. --- ### ## Thermal Performance Matrix Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic chassis: | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 8.82 °C/W | | **200 LFM (1.0 m/s)** | 6.36 °C/W | | **300 LFM (1.5 m/s)** | 5.17 °C/W | | **400 LFM (2.0 m/s)** | 4.49 °C/W | --- ### ## Component Identification The part number can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **08A:** Series/Size designation * **90:** Fin height/density configuration * **C2:** Material/Finish (Blue Anodized Aluminum) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink available with a clip-on attachment instead of pins?