The **ATS-08A-93-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight (Standard) | | **Attachment Method** | Push-Pin with Brass Springs | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance** | ~7.37 °C/W (@ 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic/Physical Components #### A. The Heat Sink Body Constructed from **Aluminum 6063**, this part features vertical fins that increase the surface area. In electronics, the goal is to transfer heat from the silicon die (junction) to the aluminum fins, where it can be carried away by convection. #### B. Push-Pin Fasteners Unlike adhesive-based heat sinks, the "93" series uses a mechanical push-pin system. * **Material:** Plastic or Brass. * **Purpose:** Provides consistent pressure (force) against the electronic component to ensure maximum thermal contact and minimize the air gap. #### C. Thermal Interface Material (TIM) The suffix **C2** indicates the use of a specific high-performance thermal interface. * **Type:** T766 Phase Change Material. * **Function:** This material fills microscopic voids between the component surface and the heat sink base. It becomes more effective as the component heats up, reducing the **Case-to-Sink (Rcs)** resistance. --- ### 3. Application Use Cases This specific part is typically used in the following electronic environments: 1. **Networking Hardware:** Routers and switches where high airflow is present. 2. **Industrial PCs:** Cooling embedded processors in compact enclosures. 3. **Power Supplies:** Managing heat for high-power transistors or voltage regulators. --- ### 4. Thermal Performance Comparison The efficiency of this part is highly dependent on the velocity of air (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural)** | 7.37 | | **200 (Low Fan)** | 3.72 | | **500 (High Fan)** | 1.84 | ---