ATS-08A-95-C2-R0
AI

The **ATS-08A-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components.
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Flowing)** | 13.30 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 7.29 °C/W @ 100 LFM |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Electronic Components & Design
The "Electronic" aspect of this part refers to its physical geometry optimized for heat dissipation from semiconductors.
* **Fins (The Heat Dissipator):** The part features a "Fine Pitch" design. In electronics, the density of these fins determines how much heat can be transferred to the surrounding air.
* **pushPIN™ Attachment:** Unlike adhesive-based heat sinks, this uses a spring-loaded mechanism. This ensures constant pressure against the chip, improving thermal conductivity and allowing for mechanical vibration resistance.
* **Blue Anodized Coating:** The chemical finish isn't just for aesthetics; it provides electrical insulation and corrosion resistance, which is critical in high-density PCB environments.
* **T766 Thermal Interface:** This is a phase-change material applied to the base. It fills microscopic air gaps between the heat sink and the electronic chip (CPU/GPU/FPGA), which is vital because air is a poor conductor of heat.
### 3. Common Applications
This heat sink is typically found in the following electronic systems:
1. **Networking Hardware:** Routers and switches where high-speed processing generates significant heat.
2. **Power Supplies:** Cooling voltage regulators or power transistors.
3. **Industrial Controllers:** Protecting sensitive logic components from thermal throttling.
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### 4. Part Number Breakdown
`ATS - 08 A - 95 - C2 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **08:** Series identifier.
* **95:** Specific geometry/fin configuration.
* **C2:** Material/Color code (Aluminum, Blue Anodized).
* **R0:** Revision/Packaging code.
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What are the advantages of pushPIN™ attachment over thermal adhesive?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the cooling performance of this part?
- ⤷ Is this heat sink compatible with standard BGA components?