Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-08A-95-C2-R0

  • AI
    The **ATS-08A-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 13.30 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 7.29 °C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The "Electronic" aspect of this part refers to its physical geometry optimized for heat dissipation from semiconductors. * **Fins (The Heat Dissipator):** The part features a "Fine Pitch" design. In electronics, the density of these fins determines how much heat can be transferred to the surrounding air. * **pushPIN™ Attachment:** Unlike adhesive-based heat sinks, this uses a spring-loaded mechanism. This ensures constant pressure against the chip, improving thermal conductivity and allowing for mechanical vibration resistance. * **Blue Anodized Coating:** The chemical finish isn't just for aesthetics; it provides electrical insulation and corrosion resistance, which is critical in high-density PCB environments. * **T766 Thermal Interface:** This is a phase-change material applied to the base. It fills microscopic air gaps between the heat sink and the electronic chip (CPU/GPU/FPGA), which is vital because air is a poor conductor of heat. ### 3. Common Applications This heat sink is typically found in the following electronic systems: 1. **Networking Hardware:** Routers and switches where high-speed processing generates significant heat. 2. **Power Supplies:** Cooling voltage regulators or power transistors. 3. **Industrial Controllers:** Protecting sensitive logic components from thermal throttling. --- ### 4. Part Number Breakdown `ATS - 08 A - 95 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series identifier. * **95:** Specific geometry/fin configuration. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN™ attachment over thermal adhesive?
    • ⤷ How does 'LFM' (Linear Feet per Minute) affect the cooling performance of this part?
    • ⤷ Is this heat sink compatible with standard BGA components?