The **ATS-08B-01-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" series, designed for easy mounting on Printed Circuit Boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08B-01-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 18.26°C/W (at 100 LFM) | | **Fin Style** | Straight (Square) | --- ### Key Components & Design Features #### 1. Heat Sink Geometry The device features a square footprint measuring **40mm x 40mm** with a low-profile height of **10mm**. The straight-fin design is optimized for environments where airflow is unidirectional, allowing heat to dissipate efficiently from the electronic component (CPU, GPU, or MOSFET) into the surrounding air. #### 2. Attachment Mechanism (Push-Pin) Unlike adhesive-based heatsinks, the `ATS-08B-01-C1-R0` utilizes a **plastic push-pin** and a **compression spring**. This provides several advantages: * **Constant Pressure:** Ensures consistent thermal interface material (TIM) contact. * **Durability:** Better mechanical stability during shock and vibration. * **Removability:** Can be uninstalled without damaging the chip or PCB. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased surface emissivity and protects the aluminum from corrosion. #### 4. Thermal Interface Material (TIM) This specific part number typically comes with **ATS-PPS-08** or similar pre-applied thermal tape or interface material. This fills the microscopic air gaps between the heatsink base and the electronic component to maximize heat transfer. --- ### Application Usage This part is commonly found in: * **Telecommunications:** Cooling of high-speed processors. * **Industrial PCs:** Maintaining stability in fan-less or restricted airflow chassis. * **Embedded Systems:** Protecting microcontrollers from thermal throttling.