The **ATS-08B-08-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to cool electronic components such as CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Performance) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 14.61°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Chomerics) pre-applied | | **Flow Orientation** | Vertical or Horizontal (Standard Cross-Cut) | --- ### 2. Key Design Elements #### A. Fin Profile (Straight Fin) The heat sink features a **straight-fin** geometry. This design is optimized for environments where there is a consistent flow of air (forced convection). The spacing between the fins is engineered to minimize pressure drop while maximizing surface area for heat dissipation. #### B. Push Pin Attachment Unlike adhesive tapes or clips, this model uses a **spring-loaded push pin** mechanism. * **Mechanical Stability:** Provides consistent pressure on the component, improving thermal contact. * **Vibration Resistance:** Ideal for industrial or automotive electronics where physical movement is expected. * **Standard Mounting:** Requires pre-drilled holes in the PCB at a standard pitch. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing contact resistance. --- ### 3. Applications and Compatibility This part is commonly used in the following electronic sectors: 1. **Telecommunications:** For cooling high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where height constraints (15mm) are present. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. --- ### 4. Part Number Breakdown (Naming Convention) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **08B:** Series/Family design * **08:** Specific fin height or configuration code * **C3:** Finish type (Blue Anodized) * **R0:** Revision or Packaging code