The **ATS-08B-112-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 2.63 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.58 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Pitch** | COARSE-PITCH | --- ### 2. Key Features and Components * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system with a brass or plastic pin and a stainless steel spring. This provides consistent pressure for optimal heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with **T766** thermal pad or paste pre-applied to the base, ensuring immediate readiness for installation. * **Fin Design:** It features a "Coarse-Pitch" fin pattern. This is optimized for airflow conditions where air is forced through the fins via a fan or system chassis airflow. * **Blue Anodized Coating:** The surface is chemically treated for corrosion resistance and improved emissivity. --- ### 3. Usage Context This component is typically found in: 1. **Telecommunications:** Cooling of high-speed processors in switches and routers. 2. **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. 3. **Power Electronics:** Managing heat for voltage regulators and power modules. --- ### 4. Dimensional Diagram (Reference) The hole pattern is critical for PCB layout: * **A (Length):** 35.00 mm * **B (Width):** 35.00 mm * **C (Height):** 25.00 mm * **E (Hole Spacing):** 40.00 mm * **F (Hole Spacing):** 40.00 mm ---