The **ATS-08B-121-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on a PCB. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 9.48°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (Heat Dissipation) The heat sink features a **straight fin** profile. In electronics, this design is optimized for unidirectional airflow. The 10mm height makes it a "low profile" solution, ideal for slim electronic enclosures or server blades where vertical space is limited. #### B. Push Pin Attachment This part uses a mechanical push pin system rather than adhesive or screws. - **Benefits:** Provides consistent pressure (clamping force) across the electronic chip, which improves heat transfer. - **Components:** Usually consists of a flexible spring and a plastic/brass pin that snaps into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The model comes with **T766** pre-applied to the base. - **Function:** This is a phase-change or grease-like material that fills microscopic air gaps between the heat sink and the electronic component. - **Importance:** Without this, the air pockets would act as insulators, causing the electronic part to overheat. --- ### 3. Usage Context This component is typically found in the following electronic applications: 1. **Telecommunications:** Cooling ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where high reliability is required. 3. **Power Electronics:** Managing heat for large voltage regulators or transistors. --- ### 4. Thermal Performance Table Thermal resistance (expressed in °C/W) varies based on the airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 9.48 | | 200 | 5.04 | | 300 | 4.02 | | 400 | 3.48 |