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  • ATS-08B-141-C2-R0

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    The **ATS-08B-141-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions Inc.* and is designed for the thermal management of electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm | | **Thermal Resistance** | 15.70°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight | --- ### 2. Key Design Features * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal interface material (T766) to ensure maximum heat transfer from the component to the sink. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a push-pin mechanism with a brass or plastic pin and a compression spring. This provides a precise, consistent pressure for better thermal contact. * **Straight Fin Design:** The "Straight Fin" configuration is optimized for systems with defined airflow, allowing air to pass through the channels efficiently to dissipate heat. * **Material Properties:** It is made from lightweight aluminum, which offers high thermal conductivity while keeping the overall weight of the PCB assembly low. --- ### 3. Application and Usage This part is commonly used in environments where space is limited but heat dissipation is critical: 1. **Networking:** Switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling voltage regulators and MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷What are the advantages of push-pin mounting over adhesive backing?
    • ⤷ How does the fin height of 10mm affect thermal performance in low-profile enclosures?
    • ⤷ What is the recommended airflow (LFM) for optimal cooling with this heat sink?