ATS-08B-141-C2-R0
AI

The **ATS-08B-141-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions Inc.* and is designed for the thermal management of electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 10.00mm |
| **Thermal Resistance** | 15.70°C/W (Unducted Flow @ 100 LFM) |
| **Fin Style** | Straight |
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### 2. Key Design Features
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal interface material (T766) to ensure maximum heat transfer from the component to the sink.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a push-pin mechanism with a brass or plastic pin and a compression spring. This provides a precise, consistent pressure for better thermal contact.
* **Straight Fin Design:** The "Straight Fin" configuration is optimized for systems with defined airflow, allowing air to pass through the channels efficiently to dissipate heat.
* **Material Properties:** It is made from lightweight aluminum, which offers high thermal conductivity while keeping the overall weight of the PCB assembly low.
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### 3. Application and Usage
This part is commonly used in environments where space is limited but heat dissipation is critical:
1. **Networking:** Switches and routers.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Power Supplies:** Cooling voltage regulators and MOSFETs.
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- ⤷What are the advantages of push-pin mounting over adhesive backing?
- ⤷ How does the fin height of 10mm affect thermal performance in low-profile enclosures?
- ⤷ What is the recommended airflow (LFM) for optimal cooling with this heat sink?