## Electronic Specifications: ATS-08B-142-C3-R0 The **ATS-08B-142-C3-R0** is a high-performance **Heat Sink** assembly designed for cooling electronic components, specifically integrated circuits (ICs) like CPUs, GPUs, or FPGAs. It belongs to the *maxiFLOW™* series by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-08B-142-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 4.92°C/W (@ 200 LFM) | | **Pressure Requirement** | 0.95 psi | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Component Design & Features The "electronic" functionality of this part is purely **passive thermal management**. Its effectiveness is determined by its geometry and material properties: * **maxiFLOW™ Fin Geometry:** The fins are designed to increase surface area while minimizing pressure drop, allowing for efficient heat dissipation even in restricted airflow environments. * **pushPIN™ Attachment:** This system uses a brass component and a stainless steel spring to provide a specific, consistent pressure against the chip. This ensures the best possible contact between the die and the heat sink. * **Blue Anodized Coating:** The finish is not just aesthetic; it provides corrosion resistance and increased surface emissivity, slightly improving radiant heat transfer. * **T412 TIM:** This is a phase-change thermal interface material. When the component heats up, the TIM softens to fill microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. ### 3. Application Use Cases This specific heat sink is typically used for: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Managing thermals in compact industrial PCs where space (30mm x 30mm) is limited. ---