The **ATS-08B-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and power transistors. --- ### Technical Specifications The table below breaks down the physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight (optimized for airflow) | | **Attachment Type** | Push-Pin | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Weight** | ~0.02 lbs (approx. 9 grams) | --- ### Key Components & Design Features #### 1. Push-Pin Attachment Mechanism The "08B" designation refers to the specific attachment method. This model uses a **spring-loaded push-pin** system. * **Benefits:** Ensures constant pressure on the electronic component (TIM - Thermal Interface Material) for better heat transfer. * **Installation:** Requires pre-drilled holes in the PCB. #### 2. Material and Coating * **Aluminum:** Lightweight with high thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and surface emissivity, aiding in radiant heat transfer. #### 3. Fin Geometry (The Heat Exchange Surface) This heat sink uses a **Straight Fin** design. * **Airflow Direction:** Works best in systems with a defined linear airflow (forced convection). * **Low Profile:** At only 10mm high, it is designed for space-constrained electronic enclosures where vertical clearance is limited. --- ### Application in Electronics This part is commonly used for cooling: * **Integrated Circuits (ICs):** Specifically high-speed processors or FPGAs. * **Power Supplies:** Regulating heat for MOSFETs or voltage regulators. * **Network Equipment:** Used on chips inside routers and switches.