The part number **ATS-08B-148-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific model belongs to their *push-pin* attachment series, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Springs | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 8.70°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (High performance phase change) | --- ### 2. Breakdown of Component Parts #### A. The Heat Sink Body The body is constructed from **Aluminum**. While copper is a better conductor, aluminum is used here to balance weight and cost. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation cooling. #### B. Push-Pin Attachment Mechanism Instead of messy adhesives or heavy bolts, this part uses a **spring-loaded push-pin system**: * **Pins:** Usually made of nylon or durable plastic. * **Springs:** Provides a consistent "downward force" (compression) to ensure the heat sink remains in tight contact with the chip, even during mechanical vibration. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific TIM applied to the base. * It uses **T766**, a thermal grease/pad that fills the microscopic air gaps between the component and the heat sink. * This ensures maximum heat transfer efficiency from the silicon die to the aluminum fins. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (Low Flow)** | 8.70 | | **400 (Med Flow)** | 4.82 | | **600 (High Flow)** | 3.82 | *Note: Lower °C/W is better, as it indicates the sink is more efficient at dissipating heat into the air.* ---