The **ATS-08B-157-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Aluminum Fin (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 40mm x 40mm | | **Height (H)** | 20mm | | **Fin Pattern** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 3.35°C/W (at 200 LFM) | --- ### 2. Physical Design Features * **XC-Cut Fin Profile:** The fins are designed with a cross-cut pattern. This allows for multi-directional airflow, making the heat sink effective regardless of which direction the fan is blowing. * **Material:** It is made from high-grade **Aluminum**, which provides a balance between lightweight design and high thermal conductivity. * **Finish:** The **Blue Anodized** finish is not just aesthetic; it protects the aluminum from corrosion and slightly improves radiant heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Attachment Mechanism The **"pushPIN™"** system is a key electronic assembly feature: 1. **Hardware:** It uses plastic push-pins and a tension spring. 2. **Mounting:** It requires pre-drilled holes on the Printed Circuit Board (PCB). 3. **Benefit:** The springs ensure consistent pressure across the component, preventing damage while maintaining maximum thermal contact. --- ### 4. Thermal Performance Comparison Thermal resistance indicates how well the part moves heat away from the electronics. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.18 | | 300 (1.5 m/s) | 2.40 | | 500 (2.5 m/s) | 1.92 |