ATS-08B-169-C2-R0
AI

The **ATS-08B-169-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic surface-mount components.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height** | 10.00 mm |
| **Fin Style** | Fine-Pitch (Square Pattern) |
| **Thermal Resistance** | 15.71 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Breakdown of the Part Number
The alphanumeric code identifies specific design choices for the cooling solution:
- **ATS-08**: Series identifier (Advanced Thermal Solutions).
- **B**: Specific manufacturing revision or batch type.
- **169**: Specific fin configuration and density code.
- **C2**: Material and Finish (Aluminum with Blue Anodize).
- **R0**: Packaging or versioning code.
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### 3. Key Electronic Functions
While the heat sink itself does not contain circuitry, it is vital for the operation of electronic systems in the following ways:
* **Thermal Dissipation:** It increases the surface area of a chip (like a CPU, GPU, or FPGA), allowing heat to transfer into the ambient air via convection.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-efficiency phase-change material that fills microscopic air gaps between the component and the heat sink.
* **Mechanical Stability:** The **pushPIN™** mechanism uses a brass attachment and a stainless steel spring to provide consistent pressure, ensuring the heat sink stays flush against the component during vibration or thermal expansion.
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### 4. Airflow Performance
Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Thermal Res (°C/W)** | 15.71 | 9.15 | 7.28 | 6.29 | 5.65 |
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- ⤷
What are the mounting hole requirements for the pushPIN attachment?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used for passive cooling without a fan?