The **ATS-08B-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for effective thermal management in electronic systems like CPUs, GPUs, and other heat-generating integrated circuits. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum (lightweight and efficient thermal conductivity) | | **Finish** | Blue Anodized (improves emissivity and corrosion resistance) | | **Attachment Type** | pushPIN™ (Spring-loaded mechanism) | | **Thermal Resistance** | 4.14°C/W (at 100 LFM / 0.5 m/s) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design Components The "Electronic Parts" of this assembly include the mechanical mounting components that ensure the thermal interface is maintained: * **The Heat Sink Body:** A block of aluminum with extruded fins that increase surface area for heat dissipation via convection. * **Compression Springs:** These provide a calculated amount of "down-force" (Pressure) to ensure the heat sink remains in tight contact with the electronic component. * **Push-Pins:** These are the fasteners that lock into the PCB holes. They are usually made of brass or plastic. * **Thermal Interface Material (TIM):** This model typically comes with **T766** pre-applied. This is a "phase change" or thermal grease layer that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Metrics Efficiency is measured by how much the temperature rises per watt of power generated: | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 4.14 | 2.38 | 1.90 | 1.66 | 1.50 | --- ### 4. Key Applications This specific part is commonly used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial motherboards and fanless systems. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators.