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  • ATS-08B-185-C2-R0

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    The **ATS-08B-185-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-08B-185-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 30.00 mm | | **Attachment Type** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 2.49 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High performance pre-applied) | --- ### Core Electronic & Mechanical Features #### 1. Thermal Management The primary purpose of this part is to dissipate heat from surface-mount electronic devices. It utilizes a **cross-cut fin pattern**, which allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan may vary. #### 2. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this uses a mechanical attachment system: * **Compression Springs:** Ensure a consistent and precise pressure is applied to the component, maximizing thermal transfer without crushing the silicon. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes (3.175mm) on the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-conductivity material that fills the microscopic air gaps between the component surface and the heat sink base. ### Performance Data (Thermal Resistance) The efficiency of the heat sink depends on the velocity of the air moving through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.49 | | 300 (1.5 m/s) | 1.48 | | 500 (2.5 m/s) | 1.18 | --- ### Comparison with Similar Models * **Height Variation:** The "185" in the part number signifies the specific height and fin configuration. Lower profile versions are available for slim-line server racks. * **Anodization:** The Blue Anodized finish isn't just for aesthetics; it provides surface protection and slightly increases emissivity compared to bare aluminum.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the T766?
    • ⤷ How does 'cross-cut' fin geometry compare to 'straight fin' geometry in terms of performance?