The **ATS-08B-191-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.32°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The heat sink features a **Cross-Cut** fin design, which is critical for maximizing surface area and allowing multi-directional airflow. * **Heat Sink Material:** High-grade aluminum provides a balance between weight and thermal conductivity. * **Fin Style:** The straight fins are cross-cut into rectangular blocks. This is ideal for systems where the airflow direction might vary or where turbulent air is present. * **Attachment:** It uses a push-pin mechanism with a brass pin and a stainless steel spring. This ensures a consistent downward pressure (clamping force) onto the chip for better heat transfer. --- ### 3. Thermal Performance Indicators The efficiency of the ATS-08B-191-C2-R0 is measured by its thermal resistance (lower is better). Its performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.32 | | 300 | 0.88 | | 400 | 0.73 | | 500 | 0.63 | --- ### 4. Key Application Notes * **Thermal Interface:** The unit comes with **T766** pre-applied. This is a high-performance phase-change material that fills the microscopic gaps between the heat sink and the component. * **Mounting Hole Pattern:** This heat sink requires specific PCB holes for the push-pins. The spacing is typically standardized for specific chip footprints (e.g., BGA packages). * **Compliance:** It is **RoHS** (Restriction of Hazardous Substances) compliant.