The **ATS-08B-201-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like BGAs (Ball Grid Arrays) and processors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Base Dimensions** | 50.00mm x 52.00mm | | **Height** | 12.00mm | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 8.17°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design Features #### A. Fin Geometry (maxiFLOW™) The "Electronic" efficiency of this part comes from its specific fin design. Unlike standard square fins, these have a spread-out profile that increases the surface area for heat dissipation while minimizing the pressure drop. This is critical for high-density PCB layouts where airflow may be restricted. #### B. pushPIN™ Attachment System The part uses a specialized mechanical attachment system: * **Compression Springs:** Ensure consistent pressure across the surface of the electronic chip. * **Brass/Plastic Pins:** Secure the heat sink directly to the PCB through pre-drilled holes, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (T766) This part comes with **T766 phase-change material** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic component (CPU/GPU/FPGA). * **Benefit:** Reduces thermal contact resistance, allowing heat to flow more effectively from the silicon to the aluminum fins. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Power Supplies:** Managing heat in voltage regulators and power converters. 3. **Industrial Computing:** Protecting processors in fanless or low-airflow enclosures. ---