The **ATS-08B-206-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 60.00 mm x 60.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine Pitch | | **Pin Type** | XC-Cut | | **Thermal Resistance** | 7.71°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Component Features #### A. XC-Cut Pattern This heatsink uses a specialized **XC-Cut** fin design. This pattern increases the surface area and creates more turbulence in the airflow, which improves heat dissipation efficiency compared to standard straight-fin designs. #### B. pushPIN™ Attachment Unlike adhesive-based cooling, this part uses a mechanical attachment system: * **Compression Springs:** Ensure consistent pressure (Load) across the thermal interface material (TIM). * **Brass/Plastic Push Pins:** Provide secure mounting to pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heatsink comes pre-applied with **T766 thermal grease**, which facilitates the transfer of heat from the component to the aluminum fins. --- ### 3. Thermal Performance Comparison The effectiveness of this part varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 5.48 °C/W | 7.71 °C/W | | 300 (1.5 m/s) | 3.12 °C/W | 3.59 °C/W | | 500 (2.5 m/s) | 2.46 °C/W | 2.73 °C/W | --- ### 4. Implementation Requirements To use this part in a design, the following hardware considerations are necessary: 1. **Hole Pattern:** The PCB must have holes spaced at **53.00 mm x 53.00 mm**. 2. **Vertical Clearance:** Ensure at least 10mm of height clearance above the component. 3. **Environment:** Designed for environments requiring RoHS and REACH compliance.