The **ATS-08B-26-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its electronic and mechanical specifications. ### 1. General Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08B-26-C2-R0 | | **Type** | Heat Sink (Top Mount) | | **Attachment Method** | Push-Pin (Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Thermal Performance Thermal resistance is critical in electronics to ensure the junction temperature of a chip does not exceed its safety limits. | Air Flow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) - Unducted | | :--- | :--- | :--- | | 100 | 0.5 | 14.20 | | 300 | 1.5 | 3.95 | | 500 | 2.5 | 2.50 | | 700 | 3.5 | 1.90 | --- ### 3. Physical Dimensions Precision sizing is required to ensure compatibility with PCB layouts and surrounding electronic components. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 10.00 mm * **Pitch (E):** 33.00 mm (Distance between mounting holes) * **Fin Pattern:** Square Pin (maximizes surface area for omnidirectional airflow) --- ### 4. Key Electronic Integration Features * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip to improve heat transfer. * **Push-Pin Mounting:** Uses a spring-loaded brass push-pin mechanism. This provides consistent pressure (load) on the electronic package, which is vital for maintaining thermal contact without cracking the silicon die. * **EMI/RFI Neutral:** Being made of aluminum, it does not inherently interfere with high-frequency signals, though its physical presence must be accounted for in RF layout designs. * **RoHS Compliant:** Meets environmental standards for electronic assembly, being free from lead and other hazardous substances. --- ### 5. Common Applications * **BGA Cooling:** Ball Grid Array processors. * **ASICs/FPGAs:** High-speed logic gates that generate significant heat. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Telecommunications:** Network switches and routers.