The **ATS-08B-31-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 25.25°C/W (Unducted @ 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Analysis #### A. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change material that ensures maximum heat transfer between the electronic chip and the aluminum base by filling microscopic air gaps. #### B. Attachment Mechanism (Push-Pin) Instead of adhesive tapes or screws, this part uses a **spring-loaded push-pin** system. * **Benefits:** Provides consistent pressure for better thermal contact. * **Hardware:** It typically uses brass or plastic pins with stainless steel springs. * **Hole Pattern:** Requires specific PCB hole spacing (usually 47mm for this series). #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling**. Because the height is relatively low (10mm), it is ideal for low-profile applications like 1U servers or compact embedded systems where vertical space is limited. --- ### 3. Applications in Electronics This heat sink is commonly used in the following scenarios: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Computing:** Protecting SOCs (System on Chips) from thermal throttling. 3. **Power Electronics:** Managing heat in large MOSFET arrays or voltage regulators. ---