The **ATS-08B-35-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **maxiFLOW™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ## 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 7.62mm | | **Thermal Resistance** | 11.00°C/W (Unducted Flow @ 200 LFM) | | **Package Cooled** | BGA (Ball Grid Array) | --- ## 2. Key Design Features The "electronic" functionality of this part is thermal management, which is critical for the stability of high-speed processors. ### A. maxiFLOW™ Fin Design The heat sink uses a specialized spread-fin geometry. This design increases the surface area for heat dissipation while maintaining low pressure drop, making it highly efficient in forced-air environments (systems with fans). ### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this model uses a mechanical **pushPIN™** system. - It includes a pre-assembled brass component and a stainless steel spring. - This ensures consistent pressure across the interface, improving thermal conductivity between the chip and the aluminum. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with a high-performance **T766** thermal phase-change material or grease pre-applied to the base, ensuring there are no air gaps between the heat sink and the electronic component. --- ## 3. Part Number Breakdown To understand the specific configuration of this part, here is the nomenclature breakdown: | Code | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Attachment Type (pushPIN™ style) | | **B** | Material/Series Type | | **35** | Dimension/Size code (approx. 37mm square) | | **C3** | Fin height/Style code | | **R0** | Finish (Blue Anodized) and Thermal Interface Material | --- ## 4. Typical Applications * **Networking:** Cooling ASICs in switches and routers. * **Computing:** Heat management for chipsets and GPUs. * **Industrial:** Power modules and high-speed BGA processors that generate significant localized heat.