ATS-08B-41-C3-R0
AI

The **ATS-08B-41-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and physical characteristics.
### 1. General Specifications
| Feature | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Part Number** | ATS-08B-41-C3-R0 |
| **Product Type** | Heatsink (Push-Pin Mount) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
---
### 2. Thermal Performance
Thermal resistance determines how effectively the part moves heat away from the semiconductor. This part is designed for high-efficiency heat dissipation in airflow environments.
* **Thermal Resistance (Unducted Flow):** ~10.07 °C/W @ 100 LFM
* **Thermal Resistance (Ducted Flow):** ~2.10 °C/W @ 100 LFM
* **Thermal Interface Material (TIM):** T412 (Pre-applied high-performance thermal tape/pad)
---
### 3. Mechanical Dimensions
This heatsink uses a square profile with a "Cross-Cut" fin design to allow airflow from multiple directions.
| Dimension | Measurement |
| :--- | :--- |
| **Length / Width** | 45.00 mm x 45.00 mm |
| **Height** | 17.50 mm |
| **Attachment Type** | Push-Pin (Spring-loaded) |
| **Pitch (Hole Spacing)** | 38.00 mm |
---
### 4. Key Components & Features
1. **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity.
2. **Push-Pin Mounting:** Uses a flexible attachment mechanism that provides consistent pressure on the chip, improving thermal contact without requiring screws.
3. **Blue Anodized Coating:** Increases the surface emissivity and protects the aluminum from corrosion/oxidation.
4. **Cross-Cut Fins:** The fins are cut horizontally and vertically. This design is ideal for systems where the direction of airflow might be inconsistent or turbulent.
### 5. Common Applications
* **Telecommunications:** Networking switches and routers.
* **Embedded Systems:** Single-board computers and industrial controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ How do I calculate the required hole size for the push-pin mounting?
- ⤷ Does this heatsink come with the thermal interface material pre-installed?