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  • ATS-08B-41-C3-R0

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    The **ATS-08B-41-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-08B-41-C3-R0 | | **Product Type** | Heatsink (Push-Pin Mount) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the semiconductor. This part is designed for high-efficiency heat dissipation in airflow environments. * **Thermal Resistance (Unducted Flow):** ~10.07 °C/W @ 100 LFM * **Thermal Resistance (Ducted Flow):** ~2.10 °C/W @ 100 LFM * **Thermal Interface Material (TIM):** T412 (Pre-applied high-performance thermal tape/pad) --- ### 3. Mechanical Dimensions This heatsink uses a square profile with a "Cross-Cut" fin design to allow airflow from multiple directions. | Dimension | Measurement | | :--- | :--- | | **Length / Width** | 45.00 mm x 45.00 mm | | **Height** | 17.50 mm | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Pitch (Hole Spacing)** | 38.00 mm | --- ### 4. Key Components & Features 1. **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. 2. **Push-Pin Mounting:** Uses a flexible attachment mechanism that provides consistent pressure on the chip, improving thermal contact without requiring screws. 3. **Blue Anodized Coating:** Increases the surface emissivity and protects the aluminum from corrosion/oxidation. 4. **Cross-Cut Fins:** The fins are cut horizontally and vertically. This design is ideal for systems where the direction of airflow might be inconsistent or turbulent. ### 5. Common Applications * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Single-board computers and industrial controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance?
    • ⤷ How do I calculate the required hole size for the push-pin mounting?
    • ⤷ Does this heatsink come with the thermal interface material pre-installed?