The **ATS-08B-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 25mm x 25mm | | **Height (from Base)** | 20mm | | **Fin Pattern** | Square-Finned (Cross-cut) | | **Thermal Resistance (Unducted)** | 15.19 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.00 °C/W @ 100 LFM | --- ### 2. Component Features * **Thermal Interface Material (TIM):** This specific model (C3) typically comes with **T412** phase-change material or high-performance grease pre-applied to the base to ensure maximum heat transfer from the chip to the aluminum fins. * **PushPIN™ Mounting:** It utilizes a brass push-pin mechanism with a stainless steel spring. This provides consistent pressure (load) on the processor, which improves thermal contact and prevents the heatsink from shifting during vibration or shipping. * **High-Efficiency Fin Design:** The "cross-cut" or square-fin geometry allows for air to flow from any direction (omnidirectional), making it ideal for compact PCB layouts where airflow direction might be inconsistent. --- ### 3. Part Number Breakdown (Nomenclature) To understand what each segment of **ATS-08B-45-C3-R0** means: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **08** | Series Identifier | | **B** | Component Material/Type | | **45** | Specific design/dimensions code | | **C3** | Thermal Interface Material (TIM) & Finish code | | **R0** | Revision/Packaging code | --- ### 4. Typical Applications This heatsink is generally found in: 1. **Telecommunications:** Cooling small chips in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Cooling MOSFETs or small voltage regulators. 4. **Consumer Electronics:** High-speed processing units that require a small footprint but high vertical dissipation.