ATS-08B-47-C3-R0
AI

The **ATS-08B-47-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core specifications:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | ~9.03 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Thermal Interface (TIM)** | T412 (Pre-applied) |
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### 2. Design and Construction
The ATS-08B-47-C3-R0 is engineered for maximum heat dissipation within a small footprint.
* **Fins:** It features a **Straight Fin** design. This is ideal for high-velocity airflows where the air can move through the channels with minimal resistance.
* **Material:** Made of high-grade aluminum which provides a balance between weight and thermal conductivity.
* **Finish:** The blue anodized coating not only provides an aesthetic look but also offers increased corrosion resistance and slightly improved emissivity.
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### 3. Mounting System
One of the key electronic integration features is the **Push Pin** mounting system:
* **Installation:** It requires pre-drilled holes on the PCB (Printed Circuit Board).
* **Pressure:** The compression springs ensure that a constant, uniform pressure is applied between the heat sink and the component, optimizing thermal transfer.
* **Reliability:** This mechanical attachment is more secure than thermal adhesive tapes, especially in high-vibration environments.
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### 4. Thermal Interface Material (TIM)
The part comes with **T412** thermal interface material pre-applied to the base.
* **Function:** T412 is a phase-change material or high-performance pad that fills microscopic air gaps between the chip surface and the heat sink.
* **Efficiency:** Pre-application ensures the correct amount of TIM is used, preventing overheating due to poor manual application.
- ⤷
What are the PCB hole size requirements for the push pin mounting?
- ⤷ How does the thermal resistance change at different airflow (LFM) levels?
- ⤷ Is this heat sink compatible with non-square electronic packages?