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  • ATS-08B-47-C3-R0

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    The **ATS-08B-47-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core specifications: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~9.03 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Design and Construction The ATS-08B-47-C3-R0 is engineered for maximum heat dissipation within a small footprint. * **Fins:** It features a **Straight Fin** design. This is ideal for high-velocity airflows where the air can move through the channels with minimal resistance. * **Material:** Made of high-grade aluminum which provides a balance between weight and thermal conductivity. * **Finish:** The blue anodized coating not only provides an aesthetic look but also offers increased corrosion resistance and slightly improved emissivity. --- ### 3. Mounting System One of the key electronic integration features is the **Push Pin** mounting system: * **Installation:** It requires pre-drilled holes on the PCB (Printed Circuit Board). * **Pressure:** The compression springs ensure that a constant, uniform pressure is applied between the heat sink and the component, optimizing thermal transfer. * **Reliability:** This mechanical attachment is more secure than thermal adhesive tapes, especially in high-vibration environments. --- ### 4. Thermal Interface Material (TIM) The part comes with **T412** thermal interface material pre-applied to the base. * **Function:** T412 is a phase-change material or high-performance pad that fills microscopic air gaps between the chip surface and the heat sink. * **Efficiency:** Pre-application ensures the correct amount of TIM is used, preventing overheating due to poor manual application.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the push pin mounting?
    • ⤷ How does the thermal resistance change at different airflow (LFM) levels?
    • ⤷ Is this heat sink compatible with non-square electronic packages?