The **ATS-08B-49-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 20.00 mm | | **Pitch** | Fine Pitch (High density) | | **Thermal Resistance** | Approx. 11.88 °C/W (Unducted flow @ 100 LFM) | --- ### 2. Key Features & Construction This component is designed to maximize surface area for heat dissipation while maintaining a compact footprint. * **Fin Design:** It utilizes a "cross-cut" or "mini-fan" fin pattern. This allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan may vary. * **Push-Pin Attachment:** The part includes a pre-assembled push-pin and spring mechanism. This ensures: * Consistent pressure across the thermal interface material (TIM). * Secure mounting without the need for specialized tools. * **Thermal Interface Material (TIM):** Most "C3" variants come with a pre-applied high-performance thermal pad (T766 or similar) to improve heat transfer between the chip and the aluminum base. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the specific version: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **08** | Attachment style/Series identifier | | **B** | Material Code (Aluminum) | | **49** | Dimension/Design sequence | | **C3** | Thermal Interface Material (TIM) and Performance grade | | **R0** | Revision/Packaging code | --- ### 4. Applications This heat sink is typically found in: 1. **Networking Hardware:** Switches, routers, and modems. 2. **Industrial PCs:** Small form-factor computers that require passive or active cooling. 3. **Embedded Systems:** Microcontrollers and SoCs that generate localized heat.