The **ATS-08B-52-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heat sink** designed by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm | | **Height** | 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 10.88°C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design utilizes a tapered fin structure. This maximizes the surface area for heat dissipation while minimizing pressure drop. In electronic systems with constrained airflow, this design ensures that the cooling fan can push air through the fins more efficiently than standard straight-fin heat sinks. #### B. Attachment Mechanism: Push-Pin The **R0** suffix indicates a specific hardware configuration involving brass push-pins and springs. * **Stability:** Provides consistent pressure on the processor or component to optimize thermal transfer. * **Installation:** Requires pre-drilled holes in the PCB. The springs ensure that vibration or mechanical shock does not dislodge the heat sink from the heat source. #### C. Thermal Interface Material (T412) The unit comes with **T412** thermal tape/grease pre-applied to the base. This material fills microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or ASIC), significantly lowering the contact thermal resistance. --- ### 3. Electronic Application This part is typically used to cool mid-range power electronic components, including: * **FPGAs and ASICs:** Used in telecommunications and networking equipment. * **Northbridge/Southbridge:** Older motherboard chipsets. * **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.88 | | 300 | 1.5 | 4.01 | | 500 | 2.5 | 2.87 | ---