The **ATS-08B-71-C3-R0** is a specific electronic component belonging to the **Thermal Management** category. Manufactured by **Advanced Thermal Solutions (ATS)**, it is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08B-71-C3-R0 | | **Heat Sink Type** | Push-Pin (Passive/Active Airflow required) | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Design Features * **Fine-Pitch Fin Design:** It utilizes a **straight-fin** configuration. This maximizes surface area for heat dissipation while maintaining a low profile (10mm height), making it ideal for space-constrained enclosures. * **Push-Pin Attachment:** Instead of using messy thermal adhesives or tapes, this model uses a mechanical push-pin system. This provides consistent pressure for better thermal transfer and allows for easier removal or rework. * **Material and Coating:** It is made of lightweight aluminum with a **Blue Anodized** finish. The anodization not only provides a professional look but also offers corrosion resistance and slight improvements in surface emissivity. * **Pre-applied TIM:** The part comes with **T412 thermal interface material** already applied to the base, ensuring a reliable thermal bond between the chip and the heat sink right out of the box. --- ### 3. Applications This part is typically used in the following environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs where vertical space is limited. 3. **High-Speed Computing:** Cooling ASICs, FPGAs, or power management modules. --- ### 4. Thermal Performance Context Thermal resistance is measured in **°C/W** (Celsius per Watt). Lower values represent better cooling. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.77 | | 300 | 1.5 | 3.24 | | 500 | 2.5 | 2.41 | ---