ATS-08B-72-C3-R0
AI

The **ATS-08B-72-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active electronic part (like a transistor or IC), but rather a **high-performance passive thermal management component**.
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### 1. General Specifications
This part is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, or high-power FPGAs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-08B-72-C3-R0 |
| **Product Type** | Heat Sink (B-Series) |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
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### 2. Technical Dimensions & Thermal Properties
The physical geometry is optimized for vertical airflow in tight electronic enclosures.
| Parameter | Value |
| :--- | :--- |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance (Unducted)** | 5.10 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.80 °C/W @ 400 LFM |
| **Pressure Drop** | High-flow design |
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### 3. Key Electronic Design Features
#### A. pushPIN™ Attachment
Unlike adhesive tapes that can degrade over time, the "08B" series uses a mechanical **pushPIN™** system. This ensures:
* Constant, high-pressure contact with the component.
* Improved thermal interface material (TIM) performance.
* Mechanical stability against shock and vibration.
#### B. Material and Coating
* **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity.
* **Blue Anodized Finish:** Enhances radiative cooling and provides corrosion resistance for long-term reliability in industrial environments.
#### C. C3 Thermal Interface Material
The "C3" in the part number indicates that the heat sink comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal grease. This eliminates the need for manual application, reducing assembly time and ensuring uniform heat transfer from the chip to the sink.
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### 4. Typical Applications
* **Networking Gear:** Switches and Routers.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
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What are the benefits of using a pushPIN attachment over thermal adhesive?
- ⤷ How does the 'Ducted' vs 'Unducted' thermal resistance affect system design?
- ⤷ Can this heat sink be customized for different pin lengths or spring tensions?