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  • ATS-08B-72-C3-R0

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    The **ATS-08B-72-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active electronic part (like a transistor or IC), but rather a **high-performance passive thermal management component**. --- ### 1. General Specifications This part is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, or high-power FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08B-72-C3-R0 | | **Product Type** | Heat Sink (B-Series) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Technical Dimensions & Thermal Properties The physical geometry is optimized for vertical airflow in tight electronic enclosures. | Parameter | Value | | :--- | :--- | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance (Unducted)** | 5.10 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.80 °C/W @ 400 LFM | | **Pressure Drop** | High-flow design | --- ### 3. Key Electronic Design Features #### A. pushPIN™ Attachment Unlike adhesive tapes that can degrade over time, the "08B" series uses a mechanical **pushPIN™** system. This ensures: * Constant, high-pressure contact with the component. * Improved thermal interface material (TIM) performance. * Mechanical stability against shock and vibration. #### B. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Enhances radiative cooling and provides corrosion resistance for long-term reliability in industrial environments. #### C. C3 Thermal Interface Material The "C3" in the part number indicates that the heat sink comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal grease. This eliminates the need for manual application, reducing assembly time and ensuring uniform heat transfer from the chip to the sink. --- ### 4. Typical Applications * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a pushPIN attachment over thermal adhesive?
    • ⤷ How does the 'Ducted' vs 'Unducted' thermal resistance affect system design?
    • ⤷ Can this heat sink be customized for different pin lengths or spring tensions?