The **ATS-08B-79-C3-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 30mm | | **Fin Style** | Push-Pin (Vertical Fin) | | **Thermal Resistance** | 2.70° C/W @ 200 LFM | | **Attachment Method** | Push-Pin with Brass Springs | | **Interface Material** | T412 (Phase Change Material) | --- ### 2. Key Electronic Functions While the heat sink itself is passive (it does not contain circuits), it is vital for the survival of active electronic parts: * **Thermal Dissipation:** It increases the surface area of the heat-generating component (the IC), allowing air to carry away heat via convection. * **Thermal Interface Material (TIM):** The "C3" in the part number indicates it comes pre-applied with **T412**, a high-performance thermal pad that fills microscopic air gaps between the chip and the metal. * **Mechanical Protection:** The push-pin mechanism ensures constant, even pressure across the surface of the electronic chip, preventing "hot spots" caused by uneven contact. --- ### 3. Application Use Cases This specific model is often found in compact electronic environments where vertical space is available but the footprint (25x25mm) is limited. 1. **Network Switches:** Cooling localized ASICs or processors. 2. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where high-vibration resistance (provided by the push-pins) is required. --- ### 4. Part Number Breakdown The code can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **08:** Product Series. * **B:** Specific design iteration. * **79:** Specific dimensions/fin configuration. * **C3:** Thermal Interface Material (T412). * **R0:** RoHS Compliance (Environmental standard).