The **ATS-08B-82-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin heatsink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 10.92°C/W (at 100 LFM) | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | --- ### 2. Breakdown of the Model Number The alphanumeric code follows a specific naming convention used by ATS: - **ATS**: Advanced Thermal Solutions. - **08**: Designates the specific series/footprint. - **B**: Revision or material variant. - **82**: Specific fin configuration and thermal profile. - **C3**: Material and Finish (C3 typically denotes **Blue Anodized** aluminum). - **R0**: RoHS compliance status (standard lead-free). --- ### 3. Key Electronic Cooling Features #### A. Cross-Cut Fin Design The heatsink utilizes a **square-cut (cross-cut)** pattern. Unlike straight fins, cross-cutting allows airflow from any direction to enter the fin array, making it ideal for systems where the airflow path is unpredictable or turbulent. #### B. Push-Pin Attachment The electronic assembly relies on a spring-loaded brass push-pin mechanism. This provides: * **Constant Pressure:** Ensures optimal contact between the heatsink and the component. * **Tool-free Installation:** Allows for quick mounting onto pre-drilled PCBs. * **Reliability:** Better vibration resistance compared to adhesive-based solutions. #### C. Thermal Interface Material (TIM) The "R0" variants usually come pre-applied with high-performance **T766 Phase Change Material** or similar thermal grease. This fills microscopic air gaps between the chip and the aluminum base to maximize heat transfer. --- ### 4. Typical Applications This part is commonly used in electronics with moderate heat dissipation requirements, such as: * **Networking Gear:** Routers, switches, and modems. * **Industrial PCs:** Compact embedded boards where space is limited (15mm height). * **Power Supplies:** Cooling MOSFETs or voltage regulators.