The **ATS-08B-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the core technical data for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-08B-86-C3-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.10°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Flow Direction** | Longitudinal | --- ### 2. Physical Design Features The "electronic" functionality of this part is passive, relying on fluid dynamics and material science to protect active electronic components from thermal failure. * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered profile. This increases the surface area while reducing the pressure drop, allowing more air to flow through the sink. * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass or plastic pin and a spring. This ensures a consistent "compression force" on the electronic chip, which is vital for maintaining a solid interface with thermal grease or pads. * **Thermal Interface Material (TIM):** The "C3" in the part number indicates it comes pre-applied with high-performance thermal interface material (T766), ensuring low thermal resistance between the chip and the heat sink right out of the box. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: 1. **ATS-08**: Series designation (maxiFLOW™). 2. **B**: Material type (Aluminum). 3. **86**: Specific footprint/size configuration. 4. **C3**: Thermal Interface Material (TIM) type and color coding. 5. **R0**: RoHS compliance and revision status. --- ### 4. Application in Systems In an electronic circuit, the ATS-08B-86-C3-R0 is typically used in: * **Telecommunications:** Cooling high-speed switching silicon. * **Embedded Computing:** Protecting processors in fan-less or restricted airflow environments. * **Power Electronics:** Managing heat for large MOSFET arrays or voltage regulators.