The **ATS-08B-87-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 13.30°C/W (Unducted @ 100 LFM) | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | --- ### 2. Key Features The "C3" designation in the part number indicates specific material and thermal interface enhancements: * **Integrated Thermal Interface Material (TIM):** This model typically comes pre-applied with **T412** thermal tape or high-performance grease. This eliminates the need for manual thermal paste application, ensuring a uniform bond between the component and the heat sink. * **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides consistent pressure (load) on the electronic chip, which improves heat transfer and ensures the sink stays secure during mechanical vibration or shipping. * **Low Profile:** With a height of only 10mm, it is designed for "1U" or "Low Profile" electronic enclosures where vertical space is extremely limited. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of networking processors in switches and routers. 2. **Embedded Systems:** Industrial PCs where high reliability and secure mounting are required. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators in compact power supplies. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.30 | | 300 (1.5 m/s) | 4.74 | | 500 (2.5 m/s) | 3.17 | | 700 (3.5 m/s) | 2.50 |