The **ATS-08B-91-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-08B-91-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | ### 2. Physical Dimensions | Dimension | Measurement | | :--- | :--- | | **Length** | 40.00 mm | | **Width** | 40.00 mm | | **Height (Fin Depth)** | 10.00 mm | | **Pitch (Hole Spacing)** | 33.00 mm | ### 3. Thermal Performance Thermal resistance indicates how effectively the part dissipates heat. Lower values are better. * **Thermal Resistance (Unducted Flow):** 22.07 °C/W @ 100 LFM (Linear Feet per Minute). * **Thermal Resistance (Ducted Flow):** 3.16 °C/W @ 100 LFM. ### 4. Key Components & Technology * **Fin Design:** This model features a **Fine-Pitch** pattern. This increases the surface area for heat dissipation while maintaining a low profile, making it ideal for tight spaces. * **pushPIN™ Attachment:** The "pushPIN" system uses a flexible, spring-loaded mechanism. This ensures constant pressure (load) on the component, improving the interface between the heat source and the sink. * **Thermal Interface Material (TIM):** The part typically comes with a pre-applied high-performance thermal grease or pad (T412), which fills microscopic air gaps between the component and the heatsink. --- ### Summary of Use Case This specific part is used in environments where **vertical space is limited** (only 10mm high) but where reliable cooling is required for processors, FPGAs, or power modules. The blue anodized finish is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer.