The **ATS-08D-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *blueICE™* series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 18.52°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Fine Pitch (Square Pattern) | | **Spring Type** | Compression Spring | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **08**: Indicates the series or specific design family. * **D**: Refers to the thermal performance/characteristic category. * **01**: Specific size/geometry identifier (40x40mm). * **C3**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic circuit is critical for the following reasons: 1. **Thermal Dissipation**: It increases the surface area of a hot component (like a CPU, FPGA, or MOSFET), allowing air to carry away heat more efficiently. 2. **Push-Pin Attachment**: This model uses a push-pin mechanism. In PCB design, this requires two pre-drilled holes in the board. The springs provide a consistent **clamping force**, ensuring maximum contact between the heatsink and the component. 3. **Thermal Interface Material (TIM)**: Usually, these parts come with a pre-applied Phase Change Material or a thermal pad on the base to bridge the microscopic air gaps between the heatsink and the chip. --- ### 4. Application Use-Cases * **Networking Hardware**: Switches and routers where airflow is constant. * **Industrial PCs**: For cooling logic controllers or embedded processors. * **Power Supplies**: Managing heat for voltage regulators.