ATS-08D-05-C3-R0
AI

The **ATS-08D-05-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Heat Sink Type** | Push-Pin (Spring-loaded) |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 12.90°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass) |
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### 2. Detailed Component Breakdown
#### A. The Fin Design (Straight Fin)
The **ATS-08D-05-C3-R0** features a straight-fin profile. This design is optimized for **forced air convection** (systems with fans). The straight gaps allow high-velocity air to flow through the channels, stripping away heat more efficiently than passive or cross-cut designs in high-airflow environments.
#### B. The Push-Pin Attachment Mechanism
This part uses a "Push-Pin" mounting system rather than adhesive tape or clips.
* **Benefits:** Provides consistent, high pressure on the component, ensuring a better thermal interface.
* **Hardware:** Includes a brass push-pin with a stainless steel spring to maintain tension.
* **PCB Requirement:** Requires pre-drilled holes in the PCB (usually 3.0mm diameter) at a specific pitch.
#### C. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** The anodizing process adds a layer of protection against corrosion and slightly increases the surface emissivity, which aids in radiant heat transfer.
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### 3. Application Use-Case
This specific heat sink is typically used in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs where mechanical stability is required (the push-pins prevent the heat sink from shifting during vibration).
3. **Power Electronics:** Cooling MOSFETs or power regulators that generate significant heat in a small footprint.
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### 4. Ordering Code Breakdown (Example)
The part number follows the ATS standard nomenclature:
* **ATS:** Manufacturer prefix.
* **08:** Series identifier.
* **D:** Attachment type (Push-Pin).
* **05:** Fin count/configuration.
* **C3:** Material/Thermal Interface Material (TIM) spec.
* **R0:** RoHS compliance and revision.
- ⤷What is the hole-to-hole pitch required for the PCB mounting of this heat sink?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How does the thermal resistance change as air flow (LFM) increases?