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  • ATS-08D-05-C3-R0

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    The **ATS-08D-05-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.90°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | --- ### 2. Detailed Component Breakdown #### A. The Fin Design (Straight Fin) The **ATS-08D-05-C3-R0** features a straight-fin profile. This design is optimized for **forced air convection** (systems with fans). The straight gaps allow high-velocity air to flow through the channels, stripping away heat more efficiently than passive or cross-cut designs in high-airflow environments. #### B. The Push-Pin Attachment Mechanism This part uses a "Push-Pin" mounting system rather than adhesive tape or clips. * **Benefits:** Provides consistent, high pressure on the component, ensuring a better thermal interface. * **Hardware:** Includes a brass push-pin with a stainless steel spring to maintain tension. * **PCB Requirement:** Requires pre-drilled holes in the PCB (usually 3.0mm diameter) at a specific pitch. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The anodizing process adds a layer of protection against corrosion and slightly increases the surface emissivity, which aids in radiant heat transfer. --- ### 3. Application Use-Case This specific heat sink is typically used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required (the push-pins prevent the heat sink from shifting during vibration). 3. **Power Electronics:** Cooling MOSFETs or power regulators that generate significant heat in a small footprint. --- ### 4. Ordering Code Breakdown (Example) The part number follows the ATS standard nomenclature: * **ATS:** Manufacturer prefix. * **08:** Series identifier. * **D:** Attachment type (Push-Pin). * **05:** Fin count/configuration. * **C3:** Material/Thermal Interface Material (TIM) spec. * **R0:** RoHS compliance and revision.
    ✨ Follow-up Questions
    • ⤷What is the hole-to-hole pitch required for the PCB mounting of this heat sink?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does the thermal resistance change as air flow (LFM) increases?