The **ATS-08D-07-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active electronic chip (like a CPU), but rather a critical passive mechanical component known as a **Heat Sink**. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its thermal and physical characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Push-Pin) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 12.7mm | | **Mounting Style** | Push-Pin (Nylon) with Compression Spring | | **Thermal Resistance** | 17.09°C/W (Unducted Flow @ 200 LFM) | | **Attachment Hole Pattern** | 38.4mm | --- ### 2. Physical Design Features The **ATS-08D-07-C3-R0** belongs to the *maxiFLOW™* family, which features a unique design meant to maximize surface area for heat dissipation. * **Finned Geometry:** It uses a "straight fin" or "flared fin" design that reduces pressure drop and increases the amount of surface area in contact with the air. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T412**, a high-performance thermal tape or grease designed to fill the microscopic gaps between the heat sink and the electronic component (like a BGA chip). * **Push-Pin Attachment:** Instead of using adhesive, it uses two spring-loaded nylon push-pins. This provides constant pressure to ensure optimal thermal contact and allows for easier removal/rework. --- ### 3. Application in Electronics This part is typically used to cool high-heat components on Printed Circuit Boards (PCBs). Common applications include: 1. **BGA Packages:** Large integrated circuits like FPGAs, Microprocessors, or Network Switches. 2. **Power Electronics:** Voltage regulators or MOSFET modules that generate significant heat. 3. **Telecommunications:** Cooling chips inside routers, switches, and base stations where airflow is present. --- ### 4. Thermal Performance Comparison Thermal performance depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 17.09 | | **300 (Medium)** | 5.34 | | **500 (High)** | 3.51 | *Note: Lower °C/W is better, as it indicates the heat sink is more efficient at moving heat away from the chip.*