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  • ATS-08D-08-C3-R0

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    The **ATS-08D-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Style** | Push-Pin (Square fins) | | **Thermal Resistance** | 14.71°C/W (Natural) / 2.30°C/W (@ 200 LFM) | | **Attachment Method** | Push-Pin with Springs | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) This part typically comes pre-applied with **T412**, a high-quality thermal interface material. This ensures that the microscopic gaps between the electronic component (heat source) and the aluminum base are filled, maximizing heat transfer efficiency. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives, this model uses a mechanical **Push-Pin and Spring** system. * **Pressure:** The springs provide consistent downward pressure on the electronic chip, which is critical for long-term thermal stability. * **Reliability:** It prevents the heat sink from shifting during vibration or shipping. #### C. Fin Design (push-PIN™ Series) The "08D" designation refers to the specific fin density and arrangement. The square fins allow for omnidirectional airflow, meaning the electronic system's cooling fans can blow air from any direction and still achieve efficient cooling. --- ### 3. Application Use Cases This part is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between natural convection and forced convection thermal resistance for this part?
    • ⤷ How do I choose the correct hole diameter for the push-pin installation?
    • ⤷ Are there alternative mounting options if my PCB does not have mounting holes?