The **ATS-08D-114-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (Rectangular) | | **Overall Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.41 °C/W (at 100 LFM) | | **Flow Orientation** | Vertical/Horizontal (Directional) | --- ## 2. Key Electronic Components & Design The ATS-08D-114-C2-R0 is engineered with specific electronic cooling requirements in mind: ### A. The PushPIN™ Mounting System Instead of using messy thermal adhesives or complex screws, this part utilizes a **spring-loaded push-pin**. - **Benefit:** Provides consistent pressure (clamping force) across the electronic chip, which improves thermal interface material (TIM) performance. - **Reliability:** Pre-assembled with a specialized spring to prevent board warping. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-08** (or similar T766) thermal grease. - **Purpose:** Fills microscopic air gaps between the silicon die (CPU/GPU/FPGA) and the aluminum base to maximize heat transfer. ### C. Fin Geometry The "Fine-Pitch" design is optimized for environments with high-velocity airflow (active cooling). The spacing between the fins is calculated to reduce pressure drop while maximizing the surface area exposed to the air. --- ## 3. Common Applications This heat sink is typically found in the following electronic systems: * **Networking Equipment:** Routers, switches, and base stations. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Single-board computers and industrial controllers. * **FPGA Cooling:** High-speed logic gates that generate significant localized heat. ---