The **ATS-08D-12-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "superGRIP" series, designed for cooling high-heat-generating components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08D-12-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision is critical for electronic PCB layouts to ensure the heat sink does not interfere with neighboring components. * **Length (A):** 54.00 mm * **Width (B):** 54.00 mm * **Height (C):** 12.70 mm * **Pitch (E):** 47.00 mm (Distance between mounting holes) --- ### 3. Key Electronic Cooling Features * **High Performance Fin Design:** The "straight-fin" architecture is optimized for airflow directed by fans or system shrouds, maximizing the surface area to dissipate heat from the semiconductor junction. * **pushPIN™ Attachment:** This model uses a specialized attachment system that includes a flexible spring. This provides a consistent, high-pressure contact between the heat sink and the electronic chip, which is vital for efficient thermal transfer. * **Thermal Interface Material (TIM):** The "-R0" suffix typically indicates that the unit comes pre-applied with a high-performance phase-change material or thermal grease, ensuring no air gaps exist between the chip and the aluminum. * **Blue Anodized Coating:** Beyond aesthetics, the anodized finish increases the surface emissivity, slightly improving radiant heat transfer and providing electrical insulation and corrosion resistance. --- ### 4. Component Application This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in base stations. 2. **Embedded Systems:** Industrial PCs where space is limited but heat output is high. 3. **Power Electronics:** Dissipating heat from large MOSFETs or VRMs (Voltage Regulator Modules).