The **ATS-08D-122-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-08D-122-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.87°C/W (at 100 LFM) | | **Dimensions** | 50mm x 50mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Advanced Pin-Fin Design Unlike standard extruded straight-fin heat sinks, this model uses a **cross-cut** or "Pin-Fin" geometry. * **Electronic Benefit:** This increases the surface area and allows for omnidirectional airflow, making it highly effective in compact electronic enclosures where airflow direction may vary. #### B. Push-Pin Attachment Mechanism The "08D" series uses a spring-loaded push-pin system. * **Function:** It provides a consistent, high-pressure connection between the heat sink and the electronic chip. * **Reliability:** This ensures that the Thermal Interface Material (TIM) is compressed correctly, minimizing the air gaps that cause overheating. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. * **Electronic Benefit:** T766 is a phase-change material that offers low thermal impedance. It ensures maximum heat transfer from the silicon die to the aluminum fins. --- ### 3. Thermal Performance Profile The efficiency of this part is highly dependent on the velocity of the air (LFM - Linear Feet per Minute) provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 5.87 | | **200 (Unducted)** | 4.06 | | **400 (Unducted)** | 2.73 | | **600 (Unducted)** | 2.10 | --- ### 4. Implementation Example If your electronic component generates **10 Watts** of heat and you have an airflow of **200 LFM**: 1. **Formula:** $\Delta T = Watts \times Thermal Resistance$ 2. **Calculation:** $10W \times 4.06°C/W = 40.6°C$ rise over ambient temperature. 3. **Result:** If your internal case temperature is 30°C, the chip will operate at approximately **70.6°C**.