The **ATS-08D-130-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Dimensions** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 5.23°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface** | T766 (Pre-applied thermal grease) | | **Fin Style** | Fine Pitch (straight fins) | --- ## Key Components & Features ### 1. The Heat Sink Body Constructed from **Aluminum 6063**, it offers a high strength-to-weight ratio and excellent thermal conductivity. The **Blue Anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. ### 2. pushPIN™ Attachment System This part utilizes a standardized "push-pin" mechanism. This is critical for electronics because: * **Constant Pressure:** It ensures the heat sink is pressed firmly against the chip, minimizing air gaps. * **Ease of Assembly:** It allows for quick installation on PCBs without specialized tools. * **Secure Fit:** The flexible springs account for thermal expansion and contraction during operation. ### 3. Thermal Interface Material (TIM) The part comes with **T766 thermal grease** pre-applied to the base. This material fills the microscopic imperfections between the heat sink and the electronic component, ensuring efficient heat conduction. --- ## Performance Metrics Thermal resistance is the most important metric for this part. It measures how many degrees Celsius the component temperature will rise per watt of power dissipated. * **Low Airflow (100 LFM):** 5.23°C/W * **High Airflow (700 LFM):** 1.83°C/W *Note: As airflow increases, the efficiency of the heat sink improves significantly.* ---