The **ATS-08D-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ## 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 60mm x 60mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Flow Orientation** | Vertical or Horizontal (Standard layout) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part utilizes the **pushPIN™** system. This consists of: * **Compression Springs:** Provide precise pressure to optimize thermal interface material (TIM) performance. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes on the PCB, ensuring it does not shift during vibration or shipping. ### B. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a protective layer against corrosion and slightly improves radiant heat emission. ### C. Fin Geometry The "131" series typically features a **cross-cut** or **straight fin** design optimized for "low-to-medium" airflow environments. The fins increase the surface area, allowing heat to transfer from the aluminum body to the surrounding air more efficiently. --- ## 3. Application Use Cases The ATS-08D-131-C2-R0 is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Protecting Industrial PCs or controllers from overheating. 3. **Power Electronics:** Managing heat for large MOSFET arrays or power modules. --- ## 4. Part Number Breakdown (Nomenclature) * **ATS:** Manufacturer (Advanced Thermal Solutions) * **08:** Product Series * **D:** Pin/Attachment Style * **131:** Specific Geometry/Footprint Code * **C2:** Thermal Interface Material (TIM) type (typically indicates a pre-applied high-performance T766 phase-change material) * **R0:** Revision code / RoHS Compliance status