The **ATS-08D-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.42°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine Pitch | --- ### 2. Key Components & Design Features #### A. Fin Design The unit features **Straight Fins** with a "Fine Pitch" configuration. This increases the surface area available for heat transfer, making it highly effective in systems with forced air cooling (fans). #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses the ATS proprietary **pushPIN™** system: * **Spring-loaded:** Ensures even pressure across the component surface for maximum thermal contact. * **Reliability:** Resistant to vibration and mechanical shock compared to peel-and-stick solutions. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material** (usually a high-performance phase-change material or grease). This fills microscopic air gaps between the heat source and the heat sink base. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Low Profile" solution due to its 10mm height. It is commonly used in: * **1U/2U Servers:** Where vertical space is strictly limited. * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs where high-density components generate significant heat. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow (LFM - Linear Feet per Minute):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.42 | | 300 (1.5 m/s) | 3.65 | | 500 (2.5 m/s) | 2.82 | ---