The **ATS-08D-14-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Fin Configuration** | Fine Pitch (Square Pattern) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's geometry and mounting: * **ATS-08**: Refers to the series and specific internal designator. * **D**: Indicates the attachment style or hole pattern. * **14**: Represents the specific fin pattern or height variation. * **C2**: Refers to the **Thermal Interface Material (TIM)**. In this case, it typically comes with **T766** pre-applied. * **R0**: Indicates the revision and finish (Blue Anodized). --- ### 3. Core Features #### A. Attachment System (pushPIN™) The "pushPIN™" system uses a flexible, spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the heat source. * **Tool-less Installation:** Securely attaches to the PCB via pre-drilled holes without needing complex mounting hardware. #### B. Thermal Performance Designed for low-profile applications, it offers high surface area relative to its height (10mm). The fine-pitch fin design maximizes heat dissipation in both forced-air (fan) and natural convection environments. #### C. Thermal Interface Material (TIM) The **C2** designation means the part comes with a pre-applied thermal pad or grease. This eliminates the need for manual application, reducing assembly time and ensuring optimal heat transfer from the chip to the aluminum. --- ### 4. Typical Applications * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and MOSFET cooling.