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  • ATS-08D-147-C3-R0

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    The **ATS-08D-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Detail | | :--- | :--- | | **Product Type** | push-PIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Features and Components ### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for excellent thermal conductivity and lightweight properties. * **Fin Style:** It utilizes a **Square Pin Fin** design. Unlike traditional straight fins, pin fins allow for omnidirectional airflow, meaning the air can enter the sink from any direction, making it ideal for cramped electronic enclosures. ### B. The Attachment System (push-PIN™) This specific model uses a specialized mechanical attachment system: 1. **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide a precise amount of downward force (pressure), ensuring optimal contact between the heat sink and the chip. 3. **Reliability:** This method is more secure than thermal adhesive tapes and allows for easier removal or rework. ### C. Thermal Interface Material (TIM) The **T412** coating is pre-applied to the base. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency. --- ## 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.65 | | 300 (1.5 m/s) | 7.69 | | 500 (2.5 m/s) | 5.91 | | 700 (3.5 m/s) | 5.07 | --- ## 4. Part Number Breakdown The suffix **-C3** typically indicates a specific spring/pin material and color (often related to the tension force), and **-R0** denotes the revision status or standard packaging.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-PIN attachment on this heat sink?
    • ⤷ How does the square pin fin design compare to straight fin designs in restricted airflow?
    • ⤷ Can the pre-applied T412 TIM be replaced with standard thermal paste?