ATS-08D-147-C3-R0
AI

The **ATS-08D-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Specification | Detail |
| :--- | :--- |
| **Product Type** | push-PIN™ Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 13.65°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 10mm |
| **Attachment Method** | Push-Pin (with springs) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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## 2. Key Features and Components
### A. The Heat Sink Body
* **Material:** Made of high-grade aluminum for excellent thermal conductivity and lightweight properties.
* **Fin Style:** It utilizes a **Square Pin Fin** design. Unlike traditional straight fins, pin fins allow for omnidirectional airflow, meaning the air can enter the sink from any direction, making it ideal for cramped electronic enclosures.
### B. The Attachment System (push-PIN™)
This specific model uses a specialized mechanical attachment system:
1. **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB.
2. **Compression Springs:** These provide a precise amount of downward force (pressure), ensuring optimal contact between the heat sink and the chip.
3. **Reliability:** This method is more secure than thermal adhesive tapes and allows for easier removal or rework.
### C. Thermal Interface Material (TIM)
The **T412** coating is pre-applied to the base. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency.
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## 3. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 13.65 |
| 300 (1.5 m/s) | 7.69 |
| 500 (2.5 m/s) | 5.91 |
| 700 (3.5 m/s) | 5.07 |
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## 4. Part Number Breakdown
The suffix **-C3** typically indicates a specific spring/pin material and color (often related to the tension force), and **-R0** denotes the revision status or standard packaging.
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What are the PCB hole requirements for the push-PIN attachment on this heat sink?
- ⤷ How does the square pin fin design compare to straight fin designs in restricted airflow?
- ⤷ Can the pre-applied T412 TIM be replaced with standard thermal paste?