ATS-08D-151-C1-R0
AI

The **ATS-08D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-Pin (Plastic) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Flowing)** | 3.90°C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
| **Fin Style** | Fine Pitch (Straight Fin) |
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## Key Components and Features
### 1. Thermal Interface Material (TIM)
The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is usually a high-performance phase-change material or thermal grease that fills the microscopic air gaps between the component surface and the heat sink base to ensure maximum heat transfer.
### 2. Push-Pin Attachment Mechanism
Instead of using adhesive tape or heavy bolts, this model uses a **spring-loaded push-pin** system.
* **Ease of Install:** Allows for quick assembly on the PCB.
* **Constant Pressure:** The springs ensure uniform pressure is applied across the component, which is critical for thermal efficiency.
### 3. Fin Geometry
The part utilizes a **straight-fin** design. This is optimized for systems with a defined airflow direction (forced convection). The fine pitch of the fins increases the surface area significantly without taking up a large volumetric footprint.
### 4. Material and Finish
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, slightly improving radiation heat transfer.
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## Applications
This specific heat sink is typically found in:
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Networking switches and routers.
* **Power Electronics:** Voltage regulators and motor drivers.
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- ⤷
What are the specific hole patterns required on a PCB for this push-pin heat sink?
- ⤷ How does the 'LFM' (Linear Feet per Minute) rating affect the thermal resistance of this part?
- ⤷ Can this heat sink be used with a custom fan attachment?