The **ATS-08D-166-C1-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically part of the **maxiFLOW™** series. These components are critical in power electronics to manage thermal loads and prevent component failure. --- ### 1. Component Specifications The following table outlines the physical and technical properties of this specific heat sink: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.18°C/W (at 200 LFM) | --- ### 2. Key Design Features The electronic and mechanical design focuses on maximizing surface area while minimizing weight. * **Tapered Fin Design:** The "maxiFLOW" geometry features a spread fin structure. This increases the surface area for convection cooling while maintaining a low pressure drop, making it efficient in forced-air environments (using fans). * **pushPIN™ Attachment:** Instead of messy thermal adhesives, this model uses a spring-loaded pin system. This ensures a consistent **pressure** between the heat sink and the electronic chip, which is vital for optimal thermal interface material (TIM) performance. * **Material Science:** The use of 6063 aluminum provides high thermal conductivity ($\approx 200 \text{ W/m·K}$) while the blue anodized coating protects the metal from oxidation and increases emissivity. --- ### 3. Application Use Cases This part is typically found in the following electronic sectors: 1. **Embedded Systems:** Cooling Microprocessors or SoCs in compact enclosures. 2. **Telecommunications:** Managing heat in high-speed networking switches. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators that generate localized heat spikes. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 15.82 | | **200** | 12.18 | | **300** | 10.44 | | **400** | 9.22 |