The **ATS-08D-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 1.0 m/s) | | **Airflow Design** | Fine Pitch (Cross-cut) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **R0** suffix indicates a pushPIN™ attachment system. This features: * **Flexible Springs:** Provide precise pressure to optimize thermal interface material (TIM) performance. * **Secure Mounting:** Prevents the heat sink from shifting during mechanical shock or vibration. * **Compression:** Ensures uniform contact across the component surface. ### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just aesthetic; the anodized layer increases surface emissivity, slightly improving radiative cooling and providing corrosion resistance. ### C. Fin Geometry The "D" in the part number signifies the fin pattern. This model typically uses a **cross-cut** or **pin-fin** array which: * Increases surface area for heat exchange. * Allows for omnidirectional airflow, meaning it works effectively regardless of which direction the fan is blowing. --- ## 3. Thermal Performance Profile Thermal resistance is measured in °C/W (degrees Celsius per Watt). Lower values represent better cooling. | Air Velocity (m/s) | 1.0 (LFM: 200) | 2.0 (LFM: 400) | 3.0 (LFM: 600) | | :--- | :--- | :--- | :--- | | **Resistance (Unducted)** | 10.07°C/W | 5.09°C/W | 3.82°C/W | --- ## 4. Typical Applications This part is commonly found in: * **Network Switches:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in voltage regulators. * **Embedded Systems:** For industrial PCs where space is limited but heat density is high.